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HPE Intel Xeon-Gold 5317 processor 3 GHz 18 MB
Overview
Intel Xeon-Gold 5317 3.0GHz 12-core 150W Processor for
Hewlett Packard Enterprise Intel Xeon-Gold 5317. Processor family: Intel® Xeon® Gold Processor socket: FCLGA4189 Processor lithography: 10 nm. Memory channels: Octa-channel Maximum internal memory supported by processor: 6144 GB Memory types supported by processor: DDR4-SDRAM. Market segment: Server Scalability: 2S
More Information
SKU |
P36931-B21 |
EAN |
0190017518640 |
Specification |
Processor |
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Processor generation | 3rd Generation Intel® Xeon® Scalable | Processor base frequency | 3 GHz | Processor manufacturer | Intel | Cooler included | No | Thermal Design Power (TDP) | 150 W | Processor cache | 18 MB | Processor model | 5317 | Processor threads | 24 | Processor operating modes | 64-bit | Processor boost frequency | 3.6 GHz | Component for | Server/workstation | Processor lithography | 10 nm | Processor family | Intel® Xeon® Gold | Processor cores | 12 | Box | No | Processor socket | LGA 4189 | Memory |
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Maximum internal memory supported by processor | 6.14 TB | Memory types supported by processor | DDR4-SDRAM | Memory clock speeds supported by processor | 2933 MHz | Memory channels | Octa-channel | ECC | Yes | Graphics |
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Discrete graphics card | No | On-board graphics card model | Not available | On-board graphics card | No | Discrete graphics card model | Not available | Power |
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Thermal Design Power (TDP) | 150 W | Technical details |
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PCI Express slots version | 4.0 | Scalability | 2S | Thermal Design Power (TDP) | 150 W | Market segment | Server | Features |
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Maximum number of PCI Express lanes | 64 | Thermal Design Power (TDP) | 150 W | PCI Express slots version | 4.0 | Scalability | 2S | Market segment | Server | Harmonized System (HS) code | 85423119 | Logistics data |
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Harmonized System (HS) code | 85423119 |
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Manufacturer |
HPE |
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