Supermicro X11DPX-T Intel® C621 LGA 3647 (Socket P)

SKU
MBD-X11DPX-T-B
In stock
AED4,698.36 AED4,474.63
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Overview
15.12"x13.2", LGA 3647, 205W, 10.4GTs, AMI 32Mb, Up to 4TB, ECC, 2933MHz, 1.2V, C621, AST2500, RJ45x2
Supermicro X11DPX-T. Processor manufacturer: Intel Processor socket: LGA 3647 (Socket P) Compatible processor series: Intel® Xeon®. Supported memory types: DDR4-SDRAM Maximum internal memory: 256 GB Memory slots type: DIMM. RAID levels: 0 1 5 10. Ethernet interface type: Gigabit Ethernet. Component for: PC Motherboard chipset family: Intel Motherboard chipset: Intel® C621
More Information
SKU MBD-X11DPX-T-B
EAN 0672042300327
Specification
Technical details
Motherboard chipset familyIntel
Motherboard chipsetIntel® C621
Component forPC
Thermal Design Power (TDP)205 W
Sustainability certificatesRoHS
Performance
Motherboard chipset familyIntel
Motherboard chipsetIntel® C621
RAID levels0, 1, 5, 10
Component forPC
Processor
Processor manufacturerIntel
Thermal Design Power (TDP)205 W
Compatible processor seriesIntel® Xeon®
Processor socketLGA 3647 (Socket P)
Memory
Number of memory slots16
Memory slots typeDIMM
Supported memory typesDDR4-SDRAM
Memory voltage1.2 V
ECCYes
Supported memory clock speeds2133,2400,2666,2933 MHz
Maximum internal memory256 GB
Storage controllers
RAID levels0, 1, 5, 10
Internal I/O
USB 3.2 Gen 2 (3.1 Gen 2) connectors1
USB 2.0 connectors2
USB 3.2 Gen 1 (3.1 Gen 1) connectors2
Number of SATA III connectors10
Rear panel I/O ports
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
USB 2.0 ports quantity2
VGA (D-Sub) ports quantity1
Ethernet LAN (RJ-45) ports2
Network
Ethernet LANYes
Wi-FiNo
Ethernet interface typeGigabit Ethernet
Features
Motherboard chipset familyIntel
Motherboard chipsetIntel® C621
Component forPC
Harmonized System (HS) code84733020
Operational conditions
Storage temperature (T-T)-40 - 70 °C
Operating temperature (T-T)10 - 35 °C
Storage relative humidity (H-H)5 - 95%
Operating relative humidity (H-H)8 - 90%
Logistics data
Harmonized System (HS) code84733020
Weight & dimensions
Width384 mm
Depth335.3 mm
Other features
Thermal Design Power (TDP)205 W
Manufacturer Supermicro
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